ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS

Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated...

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Bibliographische Detailangaben
Hauptverfasser: SHUE, ROBERT S, CHILDERS, CLIFFORD W, BEEVER, WILLIAM H
Format: Patent
Sprache:eng ; fre
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Zusammenfassung:Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler.