ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS
Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler. |
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