CONTINUOUS SOLDER PROCESSING SYSTEM

A system and method for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PECK, DOUGLAS J, FINNEY, JAMES L, SPIGARELLI, DONALD J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A system and method for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. After solder application, the product is subjected to a solder leveling or Deb ridging operation by passage past one or more nozzles which direct streams of vapor phase condensate onto the product surfaces. Each of the operations is separately controllable and is substantially independent of the control of the other operations of the overall system.