EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMINE CURING AGENTS
EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMIME CURING AGENTS The adhesion properties of amine cured epoxy resins are unexpectedly enhanced by addition of a certain combination of high and low molecular weight polyoxyalkylene polyamines. The adhesively...
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| creator | DOMINGUEZ, RICHARD J.G WADDILL, HAROLD G |
| description | EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMIME CURING AGENTS The adhesion properties of amine cured epoxy resins are unexpectedly enhanced by addition of a certain combination of high and low molecular weight polyoxyalkylene polyamines. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of a combination of about 85 wt.% or more of certain polyoxyalkylene polyamines having a molecular weight of less than about 450 and 15 wt.% or less of a polyoxyalkylene polyamine of greater than two primary amine functionality and a molecular weight of about 5,000 and above. |
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The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of a combination of about 85 wt.% or more of certain polyoxyalkylene polyamines having a molecular weight of less than about 450 and 15 wt.% or less of a polyoxyalkylene polyamine of greater than two primary amine functionality and a molecular weight of about 5,000 and above.</description><edition>4</edition><language>eng ; fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880119&DB=EPODOC&CC=CA&NR=1231796A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880119&DB=EPODOC&CC=CA&NR=1231796A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DOMINGUEZ, RICHARD J.G</creatorcontrib><creatorcontrib>WADDILL, HAROLD G</creatorcontrib><title>EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMINE CURING AGENTS</title><description>EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMIME CURING AGENTS The adhesion properties of amine cured epoxy resins are unexpectedly enhanced by addition of a certain combination of high and low molecular weight polyoxyalkylene polyamines. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of a combination of about 85 wt.% or more of certain polyoxyalkylene polyamines having a molecular weight of less than about 450 and 15 wt.% or less of a polyoxyalkylene polyamine of greater than two primary amine functionality and a molecular weight of about 5,000 and above.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjL0KwkAQhNNYiPoM7gtYxIBiuZ6bZPGyK8mFmCoEOSt_AvH98Qj2VjPfMHzz6EkXvbZQUsUCRsUhC0sGGKA4sqBjFdAUcs5yQDmB1QYKtWRqiyU0FHYHF7Vt8KA9t5aEJsaCQzN1OfkyElcto9m9f4x-9ctFtE7JmXzjh3fnx6G_-Zf_dAbjbRLvDztM_j--cRU2Ww</recordid><startdate>19880119</startdate><enddate>19880119</enddate><creator>DOMINGUEZ, RICHARD J.G</creator><creator>WADDILL, HAROLD G</creator><scope>EVB</scope></search><sort><creationdate>19880119</creationdate><title>EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMINE CURING AGENTS</title><author>DOMINGUEZ, RICHARD J.G ; WADDILL, HAROLD G</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CA1231796A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1988</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>DOMINGUEZ, RICHARD J.G</creatorcontrib><creatorcontrib>WADDILL, HAROLD G</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DOMINGUEZ, RICHARD J.G</au><au>WADDILL, HAROLD G</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMINE CURING AGENTS</title><date>1988-01-19</date><risdate>1988</risdate><abstract>EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMIME CURING AGENTS The adhesion properties of amine cured epoxy resins are unexpectedly enhanced by addition of a certain combination of high and low molecular weight polyoxyalkylene polyamines. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of a combination of about 85 wt.% or more of certain polyoxyalkylene polyamines having a molecular weight of less than about 450 and 15 wt.% or less of a polyoxyalkylene polyamine of greater than two primary amine functionality and a molecular weight of about 5,000 and above.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMINE CURING AGENTS |
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