EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMINE CURING AGENTS

EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMIME CURING AGENTS The adhesion properties of amine cured epoxy resins are unexpectedly enhanced by addition of a certain combination of high and low molecular weight polyoxyalkylene polyamines. The adhesively...

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Hauptverfasser:	DOMINGUEZ, RICHARD J.G, WADDILL, HAROLD G
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Zusammenfassung:	EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMIME CURING AGENTS The adhesion properties of amine cured epoxy resins are unexpectedly enhanced by addition of a certain combination of high and low molecular weight polyoxyalkylene polyamines. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of a combination of about 85 wt.% or more of certain polyoxyalkylene polyamines having a molecular weight of less than about 450 and 15 wt.% or less of a polyoxyalkylene polyamine of greater than two primary amine functionality and a molecular weight of about 5,000 and above.