TAPE BONDING MATERIAL AND STRUCTURE FOR ELECTRONIC CIRCUIT FABRICATION

TAPE BONDING MATERIAL AND STRUCTURE FOR ELECTRONIC CIRCUIT FABRICATION

An electronic circuit assembly is disclosed including a semiconductor die having an aluminum terminal pad on its top surface. A lead frame is disposed adjacent the semiconductor die and is adapted to be electronically connected to the die. A bided or truckload transfer tape comprising a first member...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: BUTT, SHELDON H
Format: Patent
Sprache:eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic circuit assembly is disclosed including a semiconductor die having an aluminum terminal pad on its top surface. A lead frame is disposed adjacent the semiconductor die and is adapted to be electronically connected to the die. A bided or truckload transfer tape comprising a first member formed from a nickel containing material and a second member formed from a copper containing material interconnects the terminal pad to the lead frame,