PLANARIZING LAYER FOR SEMICONDUCTOR SUBSTRATES SUCH AS SOLID STATE IMAGERS

PLANARIZING LAYER FOR SEMICONDUCTOR SUBSTRATES SUCH AS SOLID STATE IMAGERS A device is disclosed comprising a non-planar semiconductor substrate and a planarizing layer thereon, the planarizing layer having a maximum thickness that is no greater than about 3.mu. and a planarization factor P?1.0. In...

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Bibliographische Detailangaben
Hauptverfasser: PACE, LAUREL J, MCCOLGIN, WILLIAM C
Format: Patent
Sprache:eng ; fre
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Zusammenfassung:PLANARIZING LAYER FOR SEMICONDUCTOR SUBSTRATES SUCH AS SOLID STATE IMAGERS A device is disclosed comprising a non-planar semiconductor substrate and a planarizing layer thereon, the planarizing layer having a maximum thickness that is no greater than about 3.mu. and a planarization factor P?1.0. In a preferred embodiment, the layer comprises a polymer formed from a liquid monomer coated onto the substrate and thereafter polymerized.