RESIN-MOLDED SEMICONDUCTOR DEVICE AND A PROCESS FOR MANUFACTURING THE SAME

: The invention provides a process for manufacturing a semiconductor device and the semiconductor device so produced. In particular, the process permits a semiconductor pellet to be sealed in an epoxy resin in a manner that does not require the use of a mold. The epoxy resin is dropped onto the pell...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIDAKA, TOSHIYUKI, FUJIEDA, SADAO, FUKUHARA, TOSHIAKI, SAKAMOTO, HISASHI, MISAWA, YUTAKA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	: The invention provides a process for manufacturing a semiconductor device and the semiconductor device so produced. In particular, the process permits a semiconductor pellet to be sealed in an epoxy resin in a manner that does not require the use of a mold. The epoxy resin is dropped onto the pellet as the pellet is turned. The epoxy resin its then heated at 160-180.degree.C for 2 to 10 minutes as the pellet is turned, so that the surface portions of the epoxy resin are hardened. The resin is then heated at 160-200.degree.C for 3 to 24 hours while the pellet is kept stationary in order to complete the hardening of the resin. The avoidance of the use of a mold means that a very satisfactory device can be mass produced quickly and efficiently.