MAGNETRON SPUTTERING APPARATUS

SPUTTERING APPARATUS AND METHOD A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the workpiece to produce higher yield from a given cathode target.

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Bibliographische Detailangaben
Hauptverfasser:	GIANI, ENRICO, RAMACHANDRAN, KOVILVILA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	SPUTTERING APPARATUS AND METHOD A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the workpiece to produce higher yield from a given cathode target.