METAL-SEMICONDUCTOR RESISTIVE RIBBON FOR THERMAL TRANSFER PRINTING AND METHOD FOR USING

METAL-SEMICONDUCTOR RESISTIVE RIBBON FOR THERMAL TRANSFER PRINTING AND METHOD FOR USING A resistive ribbon for thermal transfer printing comprising a support layer bearing a fusible ink composition and a thin aluminum layer upon which is deposited a resistive layer of off-stoichiometric metal silici...

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Bibliographische Detailangaben
Hauptverfasser: SHIH, KWANG K, AVIRAM, ARI
Format: Patent
Sprache:eng ; fre
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Zusammenfassung:METAL-SEMICONDUCTOR RESISTIVE RIBBON FOR THERMAL TRANSFER PRINTING AND METHOD FOR USING A resistive ribbon for thermal transfer printing comprising a support layer bearing a fusible ink composition and a thin aluminum layer upon which is deposited a resistive layer of off-stoichiometric metal silicide is disclosed. Also disclosed are appropriate power sources for using the resistive ribbon, as well as methods for non-impact printing employing the disclosed ribbon.