THICK FILM RESISTOR CIRCUITS
Brown, J. F. 3-2 THICK FILM RESISTOR CIRCUITS A method of forming thick film resistor circuits whereby non-noble metals requiring a reducing firing atmosphere are included with resistor material requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at...
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| creator | BROWN, JOHN F STANTON, ROBERT M |
| description | Brown, J. F. 3-2 THICK FILM RESISTOR CIRCUITS A method of forming thick film resistor circuits whereby non-noble metals requiring a reducing firing atmosphere are included with resistor material requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. In one embodiment, the conductor paste includes copper and glass frits which can adhere to a ceramic substrate by firing at a temperature of less than 1100 degrees C. |
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The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. In one embodiment, the conductor paste includes copper and glass frits which can adhere to a ceramic substrate by firing at a temperature of less than 1100 degrees C.</description><edition>3</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; POWDER METALLURGY ; PRINTED CIRCUITS ; RESISTORS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19831220&DB=EPODOC&CC=CA&NR=1159122A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19831220&DB=EPODOC&CC=CA&NR=1159122A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BROWN, JOHN F</creatorcontrib><creatorcontrib>STANTON, ROBERT M</creatorcontrib><title>THICK FILM RESISTOR CIRCUITS</title><description>Brown, J. F. 3-2 THICK FILM RESISTOR CIRCUITS A method of forming thick film resistor circuits whereby non-noble metals requiring a reducing firing atmosphere are included with resistor material requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. 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F. 3-2 THICK FILM RESISTOR CIRCUITS A method of forming thick film resistor circuits whereby non-noble metals requiring a reducing firing atmosphere are included with resistor material requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. In one embodiment, the conductor paste includes copper and glass frits which can adhere to a ceramic substrate by firing at a temperature of less than 1100 degrees C.</abstract><edition>3</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER |
| title | THICK FILM RESISTOR CIRCUITS |
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