THICK FILM RESISTOR CIRCUITS

Brown, J. F. 3-2 THICK FILM RESISTOR CIRCUITS A method of forming thick film resistor circuits whereby non-noble metals requiring a reducing firing atmosphere are included with resistor material requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BROWN, JOHN F, STANTON, ROBERT M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Brown, J. F. 3-2 THICK FILM RESISTOR CIRCUITS A method of forming thick film resistor circuits whereby non-noble metals requiring a reducing firing atmosphere are included with resistor material requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. In one embodiment, the conductor paste includes copper and glass frits which can adhere to a ceramic substrate by firing at a temperature of less than 1100 degrees C.