EXHAUST ELECTRODE PROCESS FOR EXHAUST GAS OXYGEN SENSOR

C-3,105 A method of sputtering a platinum exhaust gas electrode onto a vitrified zirconia thimble for an electrochemical-type exhaust gas oxygen sensor. Porous high surface area platinum films are deposited that have more consistent properties. A platinum target is spaced about 3.0 - 4.5 cm from the...

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Hauptverfasser:	WILHELM, RALPH V., JR, GOLD, TERRY J, KENNARD, FREDERICK L., III, KIKUCHI, PAUL C
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY GLASS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES JOINING GLASS TO GLASS OR OTHER MATERIALS LIME, MAGNESIA MEASURING METALLURGY MINERAL OR SLAG WOOL PHYSICS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY REFRACTORIES SLAG SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING TREATMENT OF NATURAL STONE
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Zusammenfassung:	C-3,105 A method of sputtering a platinum exhaust gas electrode onto a vitrified zirconia thimble for an electrochemical-type exhaust gas oxygen sensor. Porous high surface area platinum films are deposited that have more consistent properties. A platinum target is spaced about 3.0 - 4.5 cm from the thimble and more than 6 cm from the sputtering anode. A pressure of about 10 - 20 millitorr is used during sputtering at a DC power of about 13 - 22 watts/cm2 of target area.