HEAT-ABSORBING MATERIAL

HEAT-ABSORBING MATERIAL

A heat absorbing material comprising between 12 and 51 wt % of boron carbide, between 7 and 22 wt % silicon carbide, between 1 and 10 wt % of copper, between 1 and 12 wt % of titanium diboride and between 79 and 5 wt % of carbon. The heat-absorbing material disclosed displays the requisite thermophy...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MARKOV, JURY M, BELMAR, PAVEL F, TROKHINA, GALINA N, ARABEI, BORIS G, ZVEREV. IVAN I, TJURIN, VIKTOR A, KHAZANOV, LOSIF I, ZUKHER, MARK S
Format: Patent
Sprache:eng ; fre
Schlagworte:
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Beschreibung
Zusammenfassung:A heat absorbing material comprising between 12 and 51 wt % of boron carbide, between 7 and 22 wt % silicon carbide, between 1 and 10 wt % of copper, between 1 and 12 wt % of titanium diboride and between 79 and 5 wt % of carbon. The heat-absorbing material disclosed displays the requisite thermophysical properties, high heat resistance and low density. The thermal conductivity of the material is between 82 and 37 W/m.deg over the range of temperatures between 20 and 1000.degree.C the specific heat is between 0.94 and 1.74 kJ/kg.deg at temperatures varying between 20 and 600.degree.C and the density of the material is between 2.32 and 2.50 g/cm3.