PROCESS FOR CEMENTING SEMICONDUCTOR DISCS TO CARRIER PLATES AND PRODUCT SO OBTAINED

PROCESS FOR CEMENTING SEMICONDUCTOR DISCS TO CARRIER PLATES AND PRODUCT SO OBTAINED

Process for cementing semiconductor discs to a carrier plate for subsequent polishing, which comprises applying to the discs a cementing solution being composed ofa) a resin of a melting range between 50 and 100.degree.C and a melt viscosity between 1000 and 6000 P;b) a substance acting as plasticiz...

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Bibliographische Detailangaben
Hauptverfasser: MEISSNER, BRUNO, RATH, HEINZ-JOERG, SCHMIDT, DIETRICH, VOSS, JUERGEN, REGLER, DIETER
Format: Patent
Sprache:eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:Process for cementing semiconductor discs to a carrier plate for subsequent polishing, which comprises applying to the discs a cementing solution being composed ofa) a resin of a melting range between 50 and 100.degree.C and a melt viscosity between 1000 and 6000 P;b) a substance acting as plasticizer for the resin at cementing temperatures andc) a solvent for the resin and the plasticizer, which evaporises at cementing temperatures, while avoiding during the application the occlusion of air bubbles between discs and cementing layer, and exerting pressure onto the plates at a temperature between cementing temperature and 30.degree.C below the same. The invention also comprises the carrier plate carrying one or more discs cemented there to by the above process.