HIGH SENSITIVITY RESIST SYSTEM WITH SEPARABLY DEVELOPABLE LAYERS

HIGH SENSITIVITY RESIST SYSTEM FOR LIFT-OFF METALLIZATION High sensitivity resist films for lift-off metallization are formed by coating a substrate with at least two layers of polymeric materials, each layer of which is developed by different developers that are mutually exclusive of one another. T...

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Bibliographische Detailangaben
1. Verfasser:	HATZAKIS, MICHAEL
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	HIGH SENSITIVITY RESIST SYSTEM FOR LIFT-OFF METALLIZATION High sensitivity resist films for lift-off metallization are formed by coating a substrate with at least two layers of polymeric materials, each layer of which is developed by different developers that are mutually exclusive of one another. The resist can operate for lift-off at electron beam exposure equal to or greater than 5x10-6 coulombs/cm2.