PLUG-IN MODULE FOR ELECTRONIC DEVICE HAVING SELF-CONTAINED HEAT SINK

PLUG-IN MODULE FOR ELECTRONIC DEVICE HAVING SELF CONTAINED HEAT SINK A small plug-in module includes a combined housing and heat sink, and plug-in terminals cooperating with mating terminals on a chassis. The module includes guiding structure to facilitate insertion of the module on the chassis, which may also form terminals for providing a ground connection to the module. The module includes an electronic circuit with components, at least one of which develops substantial heat, such as a transistor. The components are positioned on a substrate which is mounted in heat conducting relation on the base of the housing. The base and/or sides of the housing are constructed to provide sufficient mass to dissipate the heat developed by the components. The housing-heat sink may have recesses into which spring inserts are placed to resiliently engage pins extending from the chassis to guide the module into position and provide a ground connection thereto. Alternatively, terminal pins can be secured to the heat sink to engage sockets on the chassis. A header is provided on the module from which plug-in contacts extend for connection to sockets on the chassis, to connect the circuit of the module to the chassis. The guiding of the module by the grounding pins facilitates the engagement of the more fragile plug-in contacts.