PRESSURELESS CURING OF FILLED ETHYLENE CONTAINING POLYMERIC COMPOSITIONS

A method for curing mineral filled, ethylene-containing polymeric compositions with heat and without applying high pressures, which produces relatively dense and substantially non-porous cured polymeric products. The method comprises the addition of an organic titanate to a curable, mineral filled p...

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Bibliographische Detailangaben
1. Verfasser:	MACKENZIE, BURTON T. (JR.)
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A method for curing mineral filled, ethylene-containing polymeric compositions with heat and without applying high pressures, which produces relatively dense and substantially non-porous cured polymeric products. The method comprises the addition of an organic titanate to a curable, mineral filled polymeric composition, and heat curing the composition at approximately ambient atmospheric pressures.