HEAT SEAL CAPPER HEAD ASSEMBLY

A heat seal capper head assembly for forming a closure and sealing a container with a heat seal cap having a heat shrinkable film includes an elongated housing having at one end adaptor means for releasably securing the assembly to the conventional filling apparatus for the container, while at the opposite end of the housing there is provided means for folding and heat sealing the heat seal cap to form a heat sealed closure having a central portion and a skirt portion. The folding means includes an annular folder ring secured to the housing, and an annular center collar concentric with and slidably mounted on the folder ring, with spring means disposed between the folder ring and the center collar for biasing the collar toward its extended position. The heating means is disposed internally of the annular collar and includes a disc-shaped portion for uniformly distributing heat across the central portion of the heat seal cap.