"chip semicondutor módulo de cristal líquido e estrutura de montagem do chip semicondutor"

Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip (10) including an input bump group (110), which is composed of a plurality of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKESHI HORIGUCHI, HIROKI NAKAHAMA, TAKASHI MATSUI, MOTOJI SHIOTA
Format:	Patent
Sprache:	por
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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