"chip semicondutor módulo de cristal líquido e estrutura de montagem do chip semicondutor"

Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip (10) including an input bump group (110), which is composed of a plurality of input bumps (11) aligned in a line along one long side of its bottom surface, and an output bump group (120), which is composed of a plurality of output bumps (12) arranged in a staggered manner along the other long side of the bottom surface, a dummy bump group (130) is provided in an area between an area where the input bump group (110) is provided and an area where the output bump group (120) is provided, the dummy bump group (130) including a plurality of rectangular dummy bumps (bumps without a function of electrical connection) (13) which have long side extending along a direction perpendicular to the long sides of the bottom surface.