"montagem de painel principal incluindo um pacote que sobrepõe uma matriz diretamente ligada ao painel principal"

"montagem de painel principal incluindo um pacote que sobrepõe uma matriz diretamente ligada ao painel principal"

Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RAINER E. THOMAS, MARGARET D. RAMIREZ, DAMION SEARLS, CHARLES E. GEALER, WESTON C ROTH, JAMES D. JACKSON
Format: Patent
Sprache:por
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.