composição que compreende polióis

Heat curable resin compositions include at least one phenol-glyoxylate resin (PG resin) and at least one polyol, wherein preferably the ratio of OH from the polyol to COOH from the PG resin is from 0.01:1 to 1:1.2.

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Bibliographische Detailangaben
Hauptverfasser:	Rudolfus Antonius Theodorus Maria Van Benthem, Jozef Johannes Catherina Jacobus Boonen, Mark Martinus Maria Janssen
Format:	Patent
Sprache:	por
Schlagworte:	CASTING CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS FOUNDRY MOULDING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MINERAL OR SLAG WOOL ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POWDER METALLURGY SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Heat curable resin compositions include at least one phenol-glyoxylate resin (PG resin) and at least one polyol, wherein preferably the ratio of OH from the polyol to COOH from the PG resin is from 0.01:1 to 1:1.2.