formulação de resina de impregnação de baixa viscosidade, isenta de comonômeros, e seus usos

formulação de resina de impregnação. a presente invenção refere-se a uma formulação de resina de impregnação, que contém um componente a, que contém uma resina de poliéster insaturada, que contém éter alílico, um componente b, que contém uma resina de poliéster insaturada, terminada em diciclopentad...

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Hauptverfasser: SASCHA TÖDTER-KÖNIG, GÜNTER HEGEMANN, KLAUS-W. LIENERT, MARK ABENDROTH
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creator SASCHA TÖDTER-KÖNIG
GÜNTER HEGEMANN
KLAUS-W. LIENERT
MARK ABENDROTH
description formulação de resina de impregnação. a presente invenção refere-se a uma formulação de resina de impregnação, que contém um componente a, que contém uma resina de poliéster insaturada, que contém éter alílico, um componente b, que contém uma resina de poliéster insaturada, terminada em diciclopentadieno, diferente do componente a, um componente o, que contém um outro polímero insaturado, diferente das resinas de poliéster de acordo com os componentes a e b, bem como, opcionalmente, endurecedores, aceleradores, estabilizadores, aditivos e aditivos de reologia, bem como ao uso das mesmas para impregnação de enrolamentos, para produção de materiais básicos de materiais de isolamento planos e para revestimentos de grupos estruturais pianos. The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.
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The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</description><language>por</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; CORRECTING FLUIDS ; DYES ; DYNAMO-ELECTRIC MACHINES ; ELECTRICITY ; FILLING PASTES ; GENERATION ; INKS ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160614&amp;DB=EPODOC&amp;CC=BR&amp;NR=PI0511944B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160614&amp;DB=EPODOC&amp;CC=BR&amp;NR=PI0511944B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SASCHA TÖDTER-KÖNIG</creatorcontrib><creatorcontrib>GÜNTER HEGEMANN</creatorcontrib><creatorcontrib>KLAUS-W. 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The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. 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LIENERT</creatorcontrib><creatorcontrib>MARK ABENDROTH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SASCHA TÖDTER-KÖNIG</au><au>GÜNTER HEGEMANN</au><au>KLAUS-W. LIENERT</au><au>MARK ABENDROTH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>formulação de resina de impregnação de baixa viscosidade, isenta de comonômeros, e seus usos</title><date>2016-06-14</date><risdate>2016</risdate><abstract>formulação de resina de impregnação. a presente invenção refere-se a uma formulação de resina de impregnação, que contém um componente a, que contém uma resina de poliéster insaturada, que contém éter alílico, um componente b, que contém uma resina de poliéster insaturada, terminada em diciclopentadieno, diferente do componente a, um componente o, que contém um outro polímero insaturado, diferente das resinas de poliéster de acordo com os componentes a e b, bem como, opcionalmente, endurecedores, aceleradores, estabilizadores, aditivos e aditivos de reologia, bem como ao uso das mesmas para impregnação de enrolamentos, para produção de materiais básicos de materiais de isolamento planos e para revestimentos de grupos estruturais pianos. The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
CORRECTING FLUIDS
DYES
DYNAMO-ELECTRIC MACHINES
ELECTRICITY
FILLING PASTES
GENERATION
INKS
INSULATORS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
title formulação de resina de impregnação de baixa viscosidade, isenta de comonômeros, e seus usos
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