Composição adesiva em uma parte para carpintaria e método de adesão de substratos

An adhesive composition that includes a) an emulsion that includes a multi stage polymer that includes a first stage polymer having a Tg from -20 °C to 90 °C and including from about 0.5 % by weight to about 3 % by weight latent crosslinking monomer based on the first stage monomer weight, and a se...

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Bibliographische Detailangaben
Hauptverfasser:	NICHOLAS C. LEHMAN, SCOTT W. RHEIN, JOHN T. ANDERSON
Format:	Patent
Sprache:	por
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive composition that includes a) an emulsion that includes a multi stage polymer that includes a first stage polymer having a Tg from -20 °C to 90 °C and including from about 0.5 % by weight to about 3 % by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40 °C to 140 °C, the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.