PASTA DE SINTERIZACAO A BASE DE COBRE PARA FORMACAO DE VIAS DE PASSAGEM E CONFIGURACOES SUPERFICIAIS CONDUTORAS EM OU SOBRE SUBSTRATOS E PACOTE CERAMICO DE MULTIPLAS CAMADAS

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the vi...

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Bibliographische Detailangaben
Hauptverfasser:	SHAJI FAROOQ, LAWRENCE D. DAVID, LESTER W. HERRON, FARID YOUSSIF AOUDE, RENUKA S. DIVAKARUNI
Format:	Patent
Sprache:	por
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.