ESTRUTURA DE FITA COM ESFERAS PARA ADESAO AUTOMATIZADA A FITA,EMPACOTAMENTO EM MULTIPLAS CAMADAS,INTERCONEXAO UNIVERSAL DE MICROPLAQUETAS,INVOLUCRO DE EMPACOTAMENTO ELETRONICO E PROCESSOS EMPREGANDO FEIXES DE ENERGIA PARA A FABRICACAO DE FITAS COM ESFERAS

Automated bonding of chips (12) to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls (38, 238, 338) on the ends of beam leads (13C, 81) of the TAB tape (10C). Also balltape bonding balls (9A, 9B) are aligned on stacked TAB s...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TIMOTHY C. REILEY, PAUL ANDREW MOSKOWITZ, HARRY J. JONES, PETER G. LEDERMANN, RODNEY TREVOR HODGSON
Format:	Patent
Sprache:	por
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Automated bonding of chips (12) to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls (38, 238, 338) on the ends of beam leads (13C, 81) of the TAB tape (10C). Also balltape bonding balls (9A, 9B) are aligned on stacked TAB sheets (26, 27) and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip (12) and a multilayered ceramic package (133).