método para ligação de substrato à temperatura ambiente; e aparelho para ligação de laser de temperatura ambiente

An apparatus for room temperature laser bonding comprising an x-axis motion stage (32) mounted to a base (33); a y-axis motion stage (34) mounted to the x-axis motion stage; a substrate alignment fixture (36) mounted on the y-axis motion stage, said alignment fixture adapted to align and secure at l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GEORGES ROUSSOS, MARK FINKLE, PASCAL R. ACKERMAN-KARAM, RAYMOND MILLER KARAM, DANIELLA M. HARVEY
Format:	Patent
Sprache:	por
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus for room temperature laser bonding comprising an x-axis motion stage (32) mounted to a base (33); a y-axis motion stage (34) mounted to the x-axis motion stage; a substrate alignment fixture (36) mounted on the y-axis motion stage, said alignment fixture adapted to align and secure at least two substrates with a mutual interface as a workpiece; a gantry (44) mounted to the base and supporting alignment optics (46) for a laser (14) to focus on the workpiece in the alignment fixture; and a controller (55) for translation of the x-axis motion stage and y-axis motion stage for motion of the focused laser on the workpiece.