soluÇço de resina de poliamidaimida, seu uso para preparar esmaltes para fios, esmalte para fios e uso do mesmo, bem como fio esmaltado e seu processo de produÇço

The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparat...

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Bibliographische Detailangaben
Hauptverfasser:	KLAUS-WILHELM LIENERT, SASCHA TOEDTER-KOENIG, GEROLD SCHMIDT
Format:	Patent
Sprache:	por
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.