ôlíquido para tratamento ácido, processo para tratamento de superfícies de cobre, bem como substratos de cobre tratados com um líquido para tratamento ácidoö

The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstru...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ALEXEY STIOP, UWE HAUF, HARRY FUERHAUPTER, UDO GRIESER
Format: Patent
Sprache:por
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Beschreibung
Zusammenfassung:The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R1 and R2=alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R3=R1, R1-O, R1-S, amino or substituted amino, wherein R1 and R2 may especially be phenyl or substituted phenyl.