banho aquoso para a eletrodeposição de uma camada de nìquel e bismuto em um objeto de alumìnio ou de liga de alumìnio, processo para produção do dito objeto de alumìnio ou de liga de alumìnio, conjunto de componentes ligados por soldagem em que pelo menos um dos componentes a ser ligado por soldagem é composto de um objeto de alumìnio ou de liga de alumìnio e processo de produção de um conjunto de componentes soldados

The invention relates to a method of manufacturing an Al or Al alloy workpiece, including the steps of (a) providing an Al or Al alloy workpiece, (b) pre-treating of the outersurface of the Al or Al alloy workpiece, and (c) plating a metal layer including nickel onto the outersurface of the pre-trea...

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Bibliographische Detailangaben
Hauptverfasser:	ADRIANUS JACOBUS WITTEBROOD, JOOP NICOLAAS MOOIJ, JACQUES HUBERT OLGA JOSEPH WIJENBERG
Format:	Patent
Sprache:	por
Schlagworte:	APPARATUS THEREFOR BUILDING BUILDING MATERIALS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FIXED CONSTRUCTIONS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SOLDERING OR UNSOLDERING STRUCTURAL ELEMENTS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a method of manufacturing an Al or Al alloy workpiece, including the steps of (a) providing an Al or Al alloy workpiece, (b) pre-treating of the outersurface of the Al or Al alloy workpiece, and (c) plating a metal layer including nickel onto the outersurface of the pre-treated Al or Al alloy workpiece. During step (c) the metal layer including nickel is deposited by electroplating both nickel and bismuth using an aqueous bath comprising a nickel-ion concentration in a range of 10 to 100 g/l and a bismuth-ion concentration in the range of 0.01 to 10 g/l. The invention further relates to an aqueous plating bath for use in the method of this invention.