METHOD FOR MAKING OF MICROWARE HYBRID INTEGRATED CIRCUITS WITH THIN- LAYER RESISTOR

The method is applied in radioelectronics, instrument production and telecommunications equipment. It is simple and enhances yield. Following the method, on the facial part of a dielectric substrate under vacuum are consecutively deposited thin resistive, adhesive, conducting and protective layers,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SIMEONOVA, SVETLA V, JAKIMOV, TIKHOMIR N
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The method is applied in radioelectronics, instrument production and telecommunications equipment. It is simple and enhances yield. Following the method, on the facial part of a dielectric substrate under vacuum are consecutively deposited thin resistive, adhesive, conducting and protective layers, while its rear part - thin adhesive, conducting and protective layers. Through two consecutive photolithographies and electrochemical deposition of a conducting, barrier and anti-corrosive layer, are formed thin-layer resistors, contacting yards and micro-band elements. After thermal treatment and adjustment of the thin-layer resistors, follows the positioning of discrete elements.