EPOXY COMPOSITION
This epoxy composition can be used for gluing or manufacturing parts in mechanical engineering. Its cross-linking takes a relatively short time at moderate temperatures through the usage of accelerators, such as phosphorus-containing organic compounds, or hypophosphorous acid derivatives with the re...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | This epoxy composition can be used for gluing or manufacturing parts in mechanical engineering. Its cross-linking takes a relatively short time at moderate temperatures through the usage of accelerators, such as phosphorus-containing organic compounds, or hypophosphorous acid derivatives with the resins obtained, which exhibit high shear strength. The composition is made up, in parts by weight of the total quantity, of 100.00 dianic epoxy resin with a molecular weight of 600 and containing 18 % (w/w) epoxy groups, 35.00 maleic anhydride or 47.00 phthalic anhydride, as well as a 1.00 phosphorus-containing accelerator. The mixture is homogenized by stirring and heated to 80 degrees C. The duration of cross-linking at this temperature, depending on the type of accelerator used, ranges from between 120 and 360 minutes for the composition containing maleic anhydride to between 380 and 480 minutes for the composition containing phthalic anhydride. |
---|