Manifold provided with thermoelectric module therein

Manifold provided with thermoelectric module therein

A manifold, in which a thermoelectric module having two heating surfaces and using electric current supply to heat one of the heating surfaces and cool the other of the heating surfaces is received in at least one manifold piece, and a heat transfer medium passing cavity is formed between one heatin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TOSHIKAZU ARAKAWA, MASAFUMI NAKAMOTO, MASUO SHIMADA, KAZUMASA MIYAKE
Format: Patent
Sprache:eng
Schlagworte:
BLASTING
COMBINED HEATING AND REFRIGERATION SYSTEMS
ELECTRICITY
HEAT PUMP SYSTEMS
HEATING
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
REFRIGERATION MACHINES, PLANTS OR SYSTEMS
REFRIGERATION OR COOLING
WEAPONS
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Beschreibung
Zusammenfassung:A manifold, in which a thermoelectric module having two heating surfaces and using electric current supply to heat one of the heating surfaces and cool the other of the heating surfaces is received in at least one manifold piece, and a heat transfer medium passing cavity is formed between one heating surface of the thermoelectric module and the manifold piece. The manifold piece is provided with a sealant injection hole, through which a sealant is injected to fill a space between the periphery of the thermoelectric module and the manifold.