WATER DISPERSIBLE HOT MELT ADHESIVE COMPOSITION AND APPLICATION

The present invention is directed to both a water dispersible not melt adhesive composition and to repulpable books bound using the water dispersible adhesive of the present invention. The adhesive composition of the present invention comprises: (a) from about 40 % to 95 % by weight of a water dispe...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	FRANK BOZICH
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention is directed to both a water dispersible not melt adhesive composition and to repulpable books bound using the water dispersible adhesive of the present invention. The adhesive composition of the present invention comprises: (a) from about 40 % to 95 % by weight of a water dispersible ionically substituted polyester resin having a molecular weight from about 10,000 to about 20,000 daltons; (b) from about 60 % to about 5 % by weight of one or more compatible plasticizers; and (c) from about 0.1 % to about 1.5 % of one or more compatible stabilizers or the anti-oxidant type. Optionally, the adhesive composition may further include one or more compatible tackifiers in a total amount up to 30 % of the weight of the adhesive composition.