Dip formation of flip-chip solder bumps

A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetti...

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Bibliographische Detailangaben
Hauptverfasser:	JURRIAAN GERRETSEN, ALAIN R. E. CARRE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetting metal pad (52). The composite substrate (20) is then dipped or otherwise immersed into a reservoir of liquid solder (106). Next, the composite substrate (20) is redrawn (116), or otherwise removed, from the liquid solder to form solder bumps (113) on the at least one metal wetting pad (52).