Method and apparatus for surfacing a board-like object

The present invention is related to a method of surfacing at least one wide side of a board-like substrate, in which method at least one wide side of the substrate board and at least one sheet or web of the surfacing material are placed opposing each other. In the method, the surfacing material (1)...

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1. Verfasser: SEPPO SAUKKONEN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention is related to a method of surfacing at least one wide side of a board-like substrate, in which method at least one wide side of the substrate board and at least one sheet or web of the surfacing material are placed opposing each other. In the method, the surfacing material (1) and the board-like object (2) of the substrate material are transferred into a positioning station so that the at least one aligned edge of the surfacing material (1) and the board-like substrate (2), respectively, are made to desiredly overlap or underlap the respective edge of the opposed element surface, or alternatively, that at least one of said edges is placed essentially aligned with other respective edge of the opposed element surface, irrespective of the initial position or alignment of the surfacing material (1) and/or the board-like substrate (2) to be transferred into the positioning station.