Method of aperturing thin sheet materials

A method of forming apertures generally greater than about 0.05 square millimeters in a thin sheet material. The thin sheet material includes a first side and a second side at least one side of the thin sheet material is substantially coated with an adhesive. The method comprises the steps of (a) pl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RICHARD L JACOBSON, JOHN W LOUKS, RANDY A HOFF
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of forming apertures generally greater than about 0.05 square millimeters in a thin sheet material. The thin sheet material includes a first side and a second side at least one side of the thin sheet material is substantially coated with an adhesive. The method comprises the steps of (a) placing the adhesive-coated thin sheet material on a patterned anvil having a pattern of raised areas wherein the height of the raised areas is equal to or less than the thickness of the thin sheet material and the adhesive; and (b) subjecting the thin sheet material to a sufficient amount of sonic vibrations to aperture the thin sheet material and the adhesive; and whereby the thin sheet material and the adhesive is apertured in a pattern generally the same as the pattern of raised areas on the patterned anvil.