Metal forming process

Atomized metal is deposited metal onto a substrate so as to cause at least partial solidification of the deposited metal; further atomized metal is deposited onto the partially solidified deposited metal on the substrate; and the metal deposited onto the partially solidified deposited metal is allow...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ALLEN DENNIS ROCHE, RICHARD MICHAEL JORDAN
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Atomized metal is deposited metal onto a substrate so as to cause at least partial solidification of the deposited metal; further atomized metal is deposited onto the partially solidified deposited metal on the substrate; and the metal deposited onto the partially solidified deposited metal is allowed to fully solidify on the substrate; the cooling of the further deposited metal, and the composition of the metal and/or of a gas used in the atomization of the further atomized metal being tailored such that volumetric contraction on solidification and cooling of the further deposited metal is compensated for, when the deposited metal has been cooled to ambient temperature, by volumetric expansion in a reaction or phase change in the further deposited metal.