RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE HAVING IMPROVED ADHESION TO PLASTICIZED VINYL SUBSTRATES

The current invention provides a photopolymerized presssure-sensitive adhesive which adheres well to all common surfaces and has an outstanding ability to bond to plasticized vinyl substrates and to remain firmly bonded thereto even after remaining in contact therewith for extended periods of time c...

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Bibliographische Detailangaben
Hauptverfasser:	MARTINE HELENE ADOLPHINE DEKETELE, YVAN ADRIEN BOGAERT
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The current invention provides a photopolymerized presssure-sensitive adhesive which adheres well to all common surfaces and has an outstanding ability to bond to plasticized vinyl substrates and to remain firmly bonded thereto even after remaining in contact therewith for extended periods of time comprising an acrylic copolymer and an ethylene vinylacetate copolymer or mixture of copolymers. Preferred pressure-sensitive adhesives of the invention comprise from about 10 to about 30 parts of the ethylene vinylacetate copolymer or a mixture thereof.