PRESSURE SENSITIVE ADHESIVE

Resins having a softening point from 10 DEG C to 120 DEG C especially 10 DEG C to 80 DEG C being a copolymer of a feed which is predominantly C5 olefines and diolefines and 10 to 60 wt.% of one or more monovinyl aromatic compounds are used as a tackifier for acrylic polymers or copolymers particular...

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Bibliographische Detailangaben
Hauptverfasser:	LUTZ ERICH JACOB, GUY WOUTERS
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Resins having a softening point from 10 DEG C to 120 DEG C especially 10 DEG C to 80 DEG C being a copolymer of a feed which is predominantly C5 olefines and diolefines and 10 to 60 wt.% of one or more monovinyl aromatic compounds are used as a tackifier for acrylic polymers or copolymers particularly in aqueous based pressure sensitive adhesives.