Microfiber dielectrics which facilitate laser via drilling

This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed w...

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Bibliographische Detailangaben
Hauptverfasser:	DAVID R. HAAS, MAVYN MCAULIFFE, CHENGZENG XU
Format:	Patent
Sprache:	eng
Schlagworte:	BRAIDING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COTTON-WOOL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS KNITTING LACE-MAKING MAKING GRANULES OR PREFORMS MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-WOVEN FABRICS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PRINTED CIRCUITS RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS TEXTILES TRANSPORTING TRIMMINGS WADDING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.