ELECTROLESS PLATING

A catalytically active composition for use in electroless plating, which is prepared without the use of acid by reacting an aqueous halide solution (chloride or bromide) of a palladium salt with a compatible tin salt. The tin salt can be molten or in the form of an aqueous solution containing water...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	J.F. YORK, J.D. KLICKER, G.A. KRULIK, M.N. JAMESON
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A catalytically active composition for use in electroless plating, which is prepared without the use of acid by reacting an aqueous halide solution (chloride or bromide) of a palladium salt with a compatible tin salt. The tin salt can be molten or in the form of an aqueous solution containing water in an amount which is insufficient to cause precipitation of the tin. The final concentrated product may be used to prepare working bath solutions for electroless plating by dilution with an appropriate acid solution; but the concentrate itself contains essentially no free acid and may be either a liquid or a solid material, depending on process conditions.