Method and apparatus for magnetron sputtering

A cathode assembly for magnetron sputtering of a workpiece, and sputtering apparatus and methods of sputtering using same are provided. The cathode assembly includes a tubular cathode, which may be cylindrical in cross section along its length, or which may be curved or flexible, depending on the shape of workpiece that is to be sputtered, and which has a sputtering length of Ls. The cathode assembly also includes a magnet package, or a plurality of spaced magnet packages, each magnet package including either one magnet or a plurality of spaced magnets of alternating polarity, and having a magnet package length Lpkg which is less than Ls. The cathode assembly further includes one or more means for positioning, and preventing radial displacement of, the cathode along the axis of symmetry of the cathode. The magnet package is held within the cathode such that a driving force applied to the magnet package or to the cathode, or to both independently, imparts relative longitudinal movement between the magnet package and the cathode. The cathode assembly preferably includes cooling means. Furthermore, the magnet package(s) is preferably held within the cathode for shuttle movement. The cathode assembly allows for variations of one or more of the magnet package length, number, and spacing, and the relative displacement distance or shuttle distance, in order to tailor the erosion profile along the axis of symmetry of the cathode.