High density composite material

The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ALAN V. BRAY, MICHAEL L. DINGUS, BRIAN A. MUSKOPF
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.