Diamond cutting tool

A cutting tool with a synthetic diamond layer 2 having a cutting edge 5 is described, wherein the cutting edge 5 has a profile structured by etching of decreasing layer thickness. Furthermore, a process is described for producing such a cutting tool.

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Bibliographische Detailangaben
Hauptverfasser: ANDRE FLOTER, PETER GLUCHE
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A cutting tool with a synthetic diamond layer 2 having a cutting edge 5 is described, wherein the cutting edge 5 has a profile structured by etching of decreasing layer thickness. Furthermore, a process is described for producing such a cutting tool.