Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell

Method for applying a metallization to at least one of the outer surfaces of a substrate for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which comprises a set of relatively thin lines (fingers) and a set of relatively wide strips (busbars) connected thereto for transporting electrical charge carriers, which method comprises the steps of: (i) applying a metal-containing conductive paste to the relevant surface in accordance with said determined pattern, and (ii) drying the paste applied to the surface, wherein in the first step (i) a first paste for the set of the finger lines is applied using a stencil and a second paste for the set of the busbar strips is subsequently applied using an apparatus for contact-free application; apparatus for performing this method and photovoltaic element with substrate manufactured according to this method.