MODULAR QUANTUM PROCESSOR CONFIGURATIONS AND MODULE INTEGRATION PLATE WITH INTER-MODULE CONNECTIONS FOR THE SAME

In a general aspect, modular quantum processor configurations and methods, including integrating superconducting circuit quantum processor chips with a module integration plate that includes inter-module connections to form modular quantum processors are presented. In some cases, a quantum processing unit includes quantum processor chips, a module integration plate, and one or more caps. Each quantum processor chip includes a plurality of qubit devices. The quantum processor chips are disposed between the module integration plate and the one or more caps. The module integration plate includes recesses that house respective subsets of the quantum processor chips; and inter-module coupler devices that provide communication between the subsets of quantum processor chips housed in distinct recesses. The one or more cap wafers each includes signal lines that provide communication between at least one of the quantum processor chips and a control system.