LIQUID IMMERSION COOLING PLATFORM WITH AN ADJUSTABLE WEIR AND MULTIFUNCTIONAL COMPUTE DEVICE HANDLES

An immersion cooling system and methods for operating the system are described. The system can comprise a vessel which can be configured to hold a thermally conductive dielectric fluid; a computer component which can be configured to be at least partially submerged within the dielectric fluid; and a fluid circulation system which can be configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel. In one example embedment, there can be an adjustable weir between the bath area and the sump area. Multifunctional handles are also described.