A method for treating a wood substrate

A method for treating a wood substrate is provided. The method comprises contacting the wood substrate in a field application with an aqueous composition. The contacting is performed at a pressure of less than 20 psia. The aqueous composition comprises, by total weight of the aqueous composition, 1....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHANG, Jun, WILSON, Craig, THAM, Peter
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method for treating a wood substrate is provided. The method comprises contacting the wood substrate in a field application with an aqueous composition. The contacting is performed at a pressure of less than 20 psia. The aqueous composition comprises, by total weight of the aqueous composition, 1.0% to 10.0% by weight of a micronized basic copper carbonate, 0.35 % to 2.5% by weight of a quaternary ammonium compound, and at least 80% by weight of water. 100a 100b 104