System and method for manufacturing and assembling packaged electronic modules
A system and method of manufacturing and/or assembling packaged electronic modules for use with smart cards is disclosed. The packaged electronic modules may include contact plate(s), printed circuit(s) and/or value add components such as displays.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A system and method of manufacturing and/or assembling packaged electronic modules for use with smart cards is disclosed. The packaged electronic modules may include contact plate(s), printed circuit(s) and/or value add components such as displays. |
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